SEMICONDUCTOR INDUSTRY
Inspection Products
Various types of wafer, wirebond, substrate, die attached, pallet, leadframe, tape and reel and PCB components





Inspection Features
Colour, Mono and SWIR Inspection (Inner layer)

Colour Camera

Mono Camera

SWIR Camera

Line Scan Inspection
Suitable for long piece, continuous objects Inspection. EG: Leadframe package inspection or tape and reel inspection

Area Scan Inspection
Suitable for one individual objects inspection
Inspection Capabilities
Package Inspection

Rough Surface

Void

Package Scratches

Incomplete Fill

Crown Flash

ID pin Height

Chip on Package

Raised Flag

Package Offset

Foreign Material

Pin 1 Chip

Flash on EP
Inspection Capabilities
Tape & Reel Inspection

Scratch

Chip Out

Wrong Marking

Wrong Orientation

Foreign Material
